Resbond Fast Cure Ceramic Adhesive
adhesive for production applications from -100ºF to 2000ºF.
Compressive Strength (psi) 4000
Flexural Strength (psi) 500
Thermal Expansion (x10^-6 /ºF) 4.5
Thermal Conductivity 8
Dielectric Strength (volts/mil) 125
Volume Resistivity (ohm-cm) 10^9
Color tan
Consistency paste